Liquid cooling plates offer several advantages over traditional air cooling systems
· High heat dissipation efficiency : Direct contact high-temperature components. Liquid have higher thermal conductivity and heat capacity.
· Space utilization : Plates can closely conform to the surface of high temperature components without being limited by airflow.
· Customizable design : Meet specific application requirements, such as shape, size, and number of channels, to adapt to different equipment and product cooling needs.
· Energy-efficient and eco-friendly : Offer higher heat dissipation efficiency, reducing energy consumption and minimizing environmental impact.
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Intel CPU Dual Channel
Heat Source: Eagle Stream CPU
Heat Dissipation: 350W*2
Material: Copper Alloy
Process: TLP Welding
Working Fluid: 25%Propylene Glycol
Pressure Drop: 6kPa@1LPM
Cold Plate Dimensions: 118*78*16.5mm
Application Field: Server/Workstation CPU
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Intel CPU Liquid Cold Plate
Heat Source: Eagle Stream CPU
Heat Dissipation: 350W*2
Material: Copper Alloy
Process: TLP Welding
Working Fluid: 25% Propylene Glycol
Pressure Drop 16kPa@1LPM
Cold Plate Dimensions: 118*78*10mm
Application Field: Server/Workstation CPU
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AMD CPU Liquid Cold Plate
Heat Source: AMD SP5 CPU
Heat Dissipation: 500W*2
Material: Copper Alloy
Process: TLP Welding
Working Fluid: 25% Ethylene Glycol
Pressure Drop: 44kPa@2LPM
Cold Plate Dimensions: 116*92*18mm
Application Field: Server/Workstation CPU
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Nvidia GPU A100/A800
Name: A100/A800 Single Slot Liquid Cold Plate
Heat Source: Nvidia A100/A800 GPU
Heat Dissipation: 300W
Material: Aluminum alloy
Process: Friction Stir Welding
Coolant: 57% Ethylene Glycol Water Solution
Pressure Drop: 8.5kPa@1.5LPM
Dimensions: 420mm100mm20mm
Application: Server/Workstation Graphics Card
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Nvidia GPU A6000
Name: A6000 Single Slot Liquid Cold Plate
Heat Source: Nvidia A6000 GPU
Heat Dissipation: 300W
Material: Copper/Aluminum alloy
Process: TLP Welding
Coolant: 34% Ethylene Glycol Water Solution
Pressure Drop: 2kPa@1LPM
Dimensions: 266.8mm98mm19.5mm
Application: Server/Workstation Graphics Card
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Nvidia CPU H100/H800
Name: H100/H800 Liquid Cold Plate
Heat Source: Nvidia H100/H800 GPU
Heat Dissipation: 700W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
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Nvidia GPU 4090
Name: 4090 Single Slot Liquid Cold Plate
Heat Source: Nvidia 4090 GPU
Heat Dissipation: 450W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 20% Propylene Glycol Water Solution
Pressure Drop: 8kPa@0.5LPM
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Nvidia GPU 3080
Name: 3080 Dual Slot Liquid Cold Plate
Heat Source: Nvidia 3080 GPU
Heat Dissipation: 368W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 30% Ethylene Glycol Water Solution
Pressure Drop: 4kPa@1LPM
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Nvidia GPU 4060
Name: 4090 Dual Slot Liquid Cold Plate
Heat Source: Nvidia 4090 GPU
Heat Dissipation: 450W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 34% Ethylene Glycol Water Solution
Pressure Drop: 2.5kPa@1LPM
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