Project Overview
This project is designed for an AI field application in France, where VENTTK provides a dedicated cooling solution for heat-intensive computing equipment. With a cooling capacity of 45.01 kW, the system is engineered to maintain stable thermal conditions under continuous AI computing loads.
Leveraging VENTTK’s expertise in data center and industrial cooling solutions, the project combines a high-efficiency refrigeration configuration with EC fan technology, providing precise airflow management and improved energy performance. The system is well suited for AI-related applications where stable temperature control, reliable operation, and efficient heat rejection are critical to maintaining equipment performance.
Project Information
· Country: France
· Product: Dry Cooler
· Application: AI Field Infrastructure
· Cooling Capacity: 45.01 kW
· Cooling Medium: Ammonia R1233ZDA
· Power Supply: 380–480 V / 3 Ph / 50–60 Hz
· Fan Type: EC Fans
· Application Focus: AI Computing and High-Density Thermal Management

Project Features
1. Stable Cooling for AI Workloads
AI computing equipment generates substantial heat during intensive processing. The 45.01 kW cooling capacity provides dedicated thermal management to help maintain stable operating conditions and reduce the risk of thermal stress during continuous operation.
2. High-Efficiency EC Fan Technology
The integration of EC fans enables efficient airflow control and supports variable-speed operation. Compared with conventional fan configurations, EC technology can help optimize airflow according to actual cooling requirements, reducing unnecessary energy consumption while maintaining effective heat dissipation.
3. Flexible Electrical Compatibility
The system supports a wide power supply range of 380–480 V, 3 Ph, 50–60 Hz, providing flexibility for different electrical environments and facilitating integration into international AI infrastructure projects.
Project Significance
The rapid expansion of AI is reshaping the requirements for data center infrastructure. Higher computing density means higher heat loads, making cooling efficiency an increasingly important factor in both equipment reliability and overall facility energy performance. France is emerging as an important European market for AI and data center investment, supported by its power infrastructure and low-carbon electricity mix.
Against this background, the cooling solution provides a practical approach to thermal management for AI applications. By combining dedicated cooling capacity, EC fan technology, and flexible power compatibility, the system contributes to stable AI computing environments while supporting the broader industry trend toward more efficient and sustainable data center infrastructure.
As AI computing continues to move toward higher density and greater efficiency, advanced cooling technologies will remain a key component in building reliable, energy-conscious digital infrastructure across France and the wider European market.