SHANGHAI VENTTECH REFRIGERATION
EQUIPMENT CO.,LTD.

EN

Liquid Cold Plates

for High-Power CPUs and GPUs

Data Center Coolingcontact us

Introduction of Liquid Cold Plates

Liquid cooling plates are devices used for heat dissipation and offer advantages such as high efficiency, energy savings, and low noise.

Liquid cooling plates utilize fluid, typically water or other coolant, to conduct and cool high temperature components. They are usually made of metal and have numerous small channels through which the cooling liquid can flow and absorb heat, which is then carried away by a circulating system. This technology is widely used in electronic devices, computer chips, lasers, and other high-power equipment that require heat dissipation, effectively reducing temperatures and improving performance and lifespan of the equipment.

Liquid cooling plates offer several advantages over traditional air cooling systems:

High heat dissipation efficiency

Direct contact high-temperature components. Liquid have higher thermal conductivity and heat capacity.

Space utilization

Plates can closely conform to the surface of high temperature components without being limited by airflow.

Customizable design

Meet specific application requirements, such as shape, size, and number of channels, to adapt to different equipment and product cooling needs

Energy-efficient and eco-friendly

Offer higher heat dissipation efficiency, reducing energy consumption and minimizing environmental impact

Types of Venttk Liquid Cold Plates

Intel CPU Liquid Cold Plate

Heat Source: Eagle Stream CPU
Heat Dissipation: 350W*2
Material: Copper Alloy
Process: TLP Welding
Working Fluid: 25% Propylene Glycol
Pressure Drop 16kPa@1LPM
Cold Plate Dimensions: 118*78*10mm
Application Field: Server/Workstation CPU

Intel CPU Dual Channel

Heat Source: Eagle Stream CPU
Heat Dissipation: 350W*2
Material: Copper Alloy
Process: TLP Welding
Working Fluid: 25%Propylene Glycol 
Pressure Drop: 6kPa@1LPM
Cold Plate Dimensions: 118*78*16.5mm
Application Field: Server/Workstation CPU

AMD CPU Liquid Cold Plate

Heat Source: AMD SP5 CPU 
Heat Dissipation: 500W*2 
Material: Copper Alloy 
Process: TLP Welding 
Working Fluid: 25% Ethylene Glycol
Pressure Drop: 44kPa@2LPM 
Cold Plate Dimensions: 116*92*18mm
Application Field: Server/Workstation CPU

Nvidia GPU A6000

Name: A6000 Single Slot Liquid Cold Plate
Heat Source: Nvidia A6000 GPU
Heat Dissipation: 300W
Material: Copper/Aluminum alloy
Process: TLP Welding
Coolant: 34% Ethylene Glycol Water Solution
Pressure Drop: 2kPa@1LPM
Dimensions: 266.8mm98mm19.5mm
Application: Server/Workstation Graphics Card

Nvidia GPU A100/A800

Name: A100/A800 Single Slot Liquid Cold Plate
Heat Source: Nvidia A100/A800 GPU
Heat Dissipation: 300W
Material: Aluminum alloy
Process: Friction Stir Welding
Coolant: 57% Ethylene Glycol Water Solution
Pressure Drop: 8.5kPa@1.5LPM
Dimensions: 420mm100mm20mm
Application: Server/Workstation Graphics Card

Nvidia CPU H100/H800

Name: H100/H800 Liquid Cold Plate
Heat Source: Nvidia H100/H800 GPU
Heat Dissipation: 700W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding

Nvidia GPU 3080

Name: 3080 Dual Slot Liquid Cold Plate
Heat Source: Nvidia 3080 GPU
Heat Dissipation: 368W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 30% Ethylene Glycol Water Solution
Pressure Drop: 4kPa@1LPM

Nvidia GPU 4090

Name: 4090 Single Slot Liquid Cold Plate
Heat Source: Nvidia 4090 GPU
Heat Dissipation: 450W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 20% Propylene Glycol Water Solution
Pressure Drop: 8kPa@0.5LPM

Nvidia GPU 4060

Name: 4090 Dual Slot Liquid Cold Plate
Heat Source: Nvidia 4090 GPU
Heat Dissipation: 450W
Material: Pure Copper + Aluminum Alloy Frame
Process: TLP Welding
Coolant: 34% Ethylene Glycol Water Solution
Pressure Drop: 2.5kPa@1LPM

Comprehensive Customer Service

1

Design Simulation

• 3D structural constraints 
• Thermal source parameters 
• Fluid parameters 
• Performance requirements

2

Prototype Verification

• Structural design 
• Simulation analysis 
• Sample preparation 
• Individual product testing verification • Small batch verification

3

Mass Production

• Supplier certification audit 
• Order production

Data Center Server Cooling Solution

Data Center Cooling Solutions

Computer Room Air Conditioners Direct Expansion Unit (DX CRAC)

Computer Room Air Conditioners Direct Expansion Unit (DX CRAC)

CRAC DX unit utilizes the direct expansion cooling technology, where the refrigerant is compressed by a compressor into high-temperature and high-pressure gas. Then it expands through an expansion valve to become low-temperature and low-pressure gas, thereby achieving the desired cooling effect.It uses efficient compressors and is equipped with EC centrifugal fans to meet the continuous operation requirements 24x7. It is an ideal choice for green and energy-efficient data centers and various electronic equipment rooms. 
Inrow Cooling Chilled Water System

Inrow Cooling Chilled Water System

The Inrow Cooling Chilled Water System provides localized cooling by installing cooling units directly near the equipment, effectively reducing the temperature. The system offers advantages such as higher cooling efficiency and precision, eliminating energy losses from long-distance air distribution, and the ability to scale and adjust according to the cooling needs of different equipment.
Liquid Immersion Cooling Tank System

Liquid Immersion Cooling Tank System

The dry cooler and the immersion tank are linked together through liquid pipes.
Immersion Container System

Immersion Container System

Integral type, our customers can directly connect the pipes to use, because we put all the tanks, pumps, controllers, software, etc. in one container.
CONTACT
US